Application of dielectric isolation technology based on soot bonding

Renshi Sawada, H. Nakada

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

2 被引用数 (Scopus)

抄録

A soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. In this method, the Si-B-O soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. This soot bonding method is effective even for joining a surface with deep V-grooves or trenches, as well as for rough poly-Si-deposited surfaces. The ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction.

本文言語英語
ホスト出版物のタイトルProc 3 Int Symp Power Semicond Devices ICs ISPSD 91
編集者Ayman M. Shibib, Jayant B. Baliga
出版社Publ by IEEE
ページ203-208
ページ数6
ISBN(印刷版)0780300092
出版ステータス出版済み - 1991
外部発表はい
イベントProceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs - ISPSD '91 - Baltimore, MD, USA
継続期間: 4 22 19914 24 1991

その他

その他Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs - ISPSD '91
CityBaltimore, MD, USA
Period4/22/914/24/91

All Science Journal Classification (ASJC) codes

  • 工学(全般)

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