Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam

Yutaka Ohno, Hideto Yoshida, Naoto Kamiuchi, Ryotaro Aso, Seiji Takeda, Yasuo Shimizu, Naoki Ebisawa, Yasuyoshi Nagai, Jianbo Liang, Naoteru Shigekawa

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

1 引用 (Scopus)

抜粋

Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.

元の言語英語
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版物ステータス出版済み - 5 2019
外部発表Yes
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, 日本
継続期間: 5 21 20195 25 2019

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

会議

会議6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
日本
Kanazawa, Ishikawa
期間5/21/195/25/19

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

フィンガープリント Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Ohno, Y., Yoshida, H., Kamiuchi, N., Aso, R., Takeda, S., Shimizu, Y., Ebisawa, N., Nagai, Y., Liang, J., & Shigekawa, N. (2019). Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735379] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735379