Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface

Yasuhisa Sano, Toshiro Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Yuu Okada, Hiroaki Nishikawa, Kazuto Yamauchi

研究成果: 著書/レポートタイプへの貢献会議での発言

2 引用 (Scopus)

抄録

Plasma chemical vaporization machining (PCVM) is a high-speed plasma etching method using atmospheric-pressure plasma. Although it does not leave an affected layer on the processed surface because of the small ion energy owing to the small mean free path of gas molecules, it is not suitable for planarization because of its isotropic etching. Thus, a combination of PCVM and a mechanical machining process is proposed. The convex parts of a substrate surface are considered to be affected by mechanical machining and are removed preferentially by PCVM. In this report, it is investigated whether etching rate of the affected layer becomes larger or not. As a result, it was found that the etching rate increased in the first 100 nm depth of the mechanically polished substrate, which corresponds to the thickness of the heavily damaged layer observed by cross-sectional transmission electron microscopy.

元の言語英語
ホスト出版物のタイトルPrecision Engineering and Nanotechnology V
出版者Trans Tech Publications Ltd
ページ550-553
ページ数4
ISBN(印刷物)9783038352112
DOI
出版物ステータス出版済み - 1 1 2015
イベント5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013 - Taipei, 台湾省、中華民国
継続期間: 11 12 201311 15 2013

出版物シリーズ

名前Key Engineering Materials
625
ISSN(印刷物)1013-9826

その他

その他5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013
台湾省、中華民国
Taipei
期間11/12/1311/15/13

Fingerprint

Vaporization
Etching
Machining
Plasmas
Plasma etching
Substrates
Atmospheric pressure
Gases
Ions
Transmission electron microscopy
Molecules

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Sano, Y., Doi, T., Kurokawa, S., Aida, H., Ohnishi, O., Uneda, M., ... Yamauchi, K. (2015). Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface. : Precision Engineering and Nanotechnology V (pp. 550-553). (Key Engineering Materials; 巻数 625). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.625.550

Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface. / Sano, Yasuhisa; Doi, Toshiro; Kurokawa, Syuhei; Aida, Hideo; Ohnishi, Osamu; Uneda, Michio; Okada, Yuu; Nishikawa, Hiroaki; Yamauchi, Kazuto.

Precision Engineering and Nanotechnology V. Trans Tech Publications Ltd, 2015. p. 550-553 (Key Engineering Materials; 巻 625).

研究成果: 著書/レポートタイプへの貢献会議での発言

Sano, Y, Doi, T, Kurokawa, S, Aida, H, Ohnishi, O, Uneda, M, Okada, Y, Nishikawa, H & Yamauchi, K 2015, Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface. : Precision Engineering and Nanotechnology V. Key Engineering Materials, 巻. 625, Trans Tech Publications Ltd, pp. 550-553, 5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013, Taipei, 台湾省、中華民国, 11/12/13. https://doi.org/10.4028/www.scientific.net/KEM.625.550
Sano Y, Doi T, Kurokawa S, Aida H, Ohnishi O, Uneda M その他. Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface. : Precision Engineering and Nanotechnology V. Trans Tech Publications Ltd. 2015. p. 550-553. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.625.550
Sano, Yasuhisa ; Doi, Toshiro ; Kurokawa, Syuhei ; Aida, Hideo ; Ohnishi, Osamu ; Uneda, Michio ; Okada, Yuu ; Nishikawa, Hiroaki ; Yamauchi, Kazuto. / Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface. Precision Engineering and Nanotechnology V. Trans Tech Publications Ltd, 2015. pp. 550-553 (Key Engineering Materials).
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AU - Ohnishi, Osamu

AU - Uneda, Michio

AU - Okada, Yuu

AU - Nishikawa, Hiroaki

AU - Yamauchi, Kazuto

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