Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge

Keiichiro Iwanabe, Kenichi Nakadozono, Yousuke Senda, Tanemasa Asano

研究成果: ジャーナルへの寄稿記事

6 引用 (Scopus)

抄録

The bonding dynamics of a cone-shaped microbump during ultrasonic bonding are investigated by in situ measurements of the strain generated in a substrate using a piezoresistance strain sensor. The strain sensor is composed of a pair of p-and n-type piezoresistance gauges to extract strain components in the ultrasonic vibration along the plane parallel to the substrate surface and along the direction perpendicular to the surface. Flipchip bonding is performed at room-temperature. The time evolution of the strain generated in the substrate according to the load-up of pressing force and application of ultrasonic vibration is clearly detected. The softening of the bump metal during the application of ultrasonic vibration is clearly observed. Results of a comparative study between the bonding of a cone-shaped microbump and that of a flat-top microbump suggest mechanical stress concentration near the top end of the cone-shaped microbump, which results in the transformation of the crystal texture of the bump from grains to fine crystallites.

元の言語英語
記事番号06GP22
ジャーナルJapanese Journal of Applied Physics
55
発行部数6
DOI
出版物ステータス出版済み - 6 1 2016

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strain gages
Strain gages
ultrasonics
Ultrasonics
cones
Vibrations (mechanical)
Cones
vibration
Substrates
stress concentration
sensors
pressing
in situ measurement
softening
crystallites
Sensors
Crystallites
textures
Gages
Stress concentration

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

これを引用

Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge. / Iwanabe, Keiichiro; Nakadozono, Kenichi; Senda, Yousuke; Asano, Tanemasa.

:: Japanese Journal of Applied Physics, 巻 55, 番号 6, 06GP22, 01.06.2016.

研究成果: ジャーナルへの寄稿記事

Iwanabe, Keiichiro ; Nakadozono, Kenichi ; Senda, Yousuke ; Asano, Tanemasa. / Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge. :: Japanese Journal of Applied Physics. 2016 ; 巻 55, 番号 6.
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