MEMSパッケージ封止接合部の強度信頼性評価

片桐 大輔, 横山 吉典, 坂本 博夫, 濱田 繁

研究成果: Contribution to journalArticle査読

抄録

In order to secure the certain operation of MEMS devices, it is very important to design a hermetically sealed package which protects the device from wet environments, taking into account the reliability of cap bonding of MEMS packages. Anodic bonding is a popular cap bonding method. In this process, glass and single crystal silicon are bonded at high temperature under high voltage conditions. In this study, the new production method of device size specimen with an interface crack by wafer process is proposed. And an attempt is made to establish a method of testing the cap bonding strength of packages and to make clear the interface strength of anodic bonding between the glass and single crystal silicon.
寄稿の翻訳タイトルBonding Strength Evaluation for Hermetic Seal of MEMS Package
本文言語日本語
ページ(範囲)926-931
ページ数6
ジャーナルZairyo/Journal of the Society of Materials Science, Japan
56
10
DOI
出版ステータス出版済み - 2007

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