Change in slip mode with temperature in Ti0.49mass%O

Masaki Tanaka, Yukihiro Hayashi, Yelm Okuyama, Tatsuya Morikawa, Kenji Higashida

    研究成果: ジャーナルへの寄稿学術誌査読

    3 被引用数 (Scopus)

    抄録

    The temperature dependence of 0.2% proof stress was investigated in Ti0.49 mass%O with an ¡ single phase. The 0.2% proof stress decreased as the temperature increased from 77 to 573 K. The athermal stress, which was defined as the average of the stress values for which the temperature dependence was absent above 573 K, was found to be 70 MPa. The temperature dependence of the effective stress indicates that the temperature dependence of the effective stress changed at around 400 K. To study the thermally activated process that controls the yielding in Ti, the temperature dependence of the activation volume was also measured. An inverse temperature dependence of the activation volume was found at between 325 and 400 K, suggesting that the thermally activated process of dislocation glide changed at this temperature. Prismatic slip with

    本文言語英語
    ページ(範囲)80-85
    ページ数6
    ジャーナルMaterials Transactions
    60
    1
    DOI
    出版ステータス出版済み - 2019

    !!!All Science Journal Classification (ASJC) codes

    • 材料科学(全般)
    • 凝縮系物理学
    • 材料力学
    • 機械工学

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