A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step. The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass is deduced from the failure map to be 0.91 MPa·m1/2, in line with the reported value of 0.80 MPa·m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.
|ホスト出版物のタイトル||54th SPSJ Annual Meeting 2005 - Polymer Preprints, Japan|
|出版ステータス||出版済み - 2005|
|イベント||54th SPSJ Annual Meeting 2005 - Yokohama, 日本|
継続期間: 5 25 2005 → 5 27 2005
|その他||54th SPSJ Annual Meeting 2005|
|Period||5/25/05 → 5/27/05|
All Science Journal Classification (ASJC) codes