Comparison of microstructures in electroformed copper liners of shaped charges before and after plastic deformation at different strain rates

W. H. Tian, A. L. Fan, H. Y. Gao, J. Luo, Z. Wang

研究成果: Contribution to journalArticle査読

26 被引用数 (Scopus)

抄録

Transmission electron microscopy observations of the recovered slugs of electroformed copper liner materials that had undergone high-strain-rate deformation show the existence of a wide range of crystal defects, including vacancy clusters and porosity. Cellular structures formed by tangled dislocations and subgrain boundaries consisting of dislocation arrays were also detected. Electron backscattering Kikuchi pattern technique analysis reveals that the fibrous texture observed in the as-formed copper liners of shaped charges disappeared after explosive detonation deformation. In a specimen that had been plastically deformed at a normal strain rate (4 × 10-4 s-1), a high density of dislocations was observed within grains. These experimental results indicate that dynamic recovery and recrystallization play an important role during high-strain-rate deformation by virtue of a temperature increase in the deformation process, whereas the conventional slip mechanism operates during deformation at the normal strain rates.

本文言語英語
ページ(範囲)160-167
ページ数8
ジャーナルMaterials Science and Engineering A
350
1-2
DOI
出版ステータス出版済み - 6 15 2003
外部発表はい

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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