Three-dimensional integration with through silicon vias offers a promising solution for future technology nodes. However, the heat accumulation and thermal strain may seriously affect performance, leakage, and reliability of circuits. The cross-plane thermal transport, generation, and propagation of coherent acoustic-phonon wave in thin Pt film-glass substrate have been comprehensively studied by applying the picosecond laser pump-probe method with different configurations. Significantly different time-dependent reflectance signals have been obtained in different configurations and an effect superposition model is proposed to account for cross plane thermal transport inducing ipsi- and contralateral temperature change in thin Pt film, propagation of coherent acoustic-phonon wave in thin Pt film and in glass substrate. The corresponding theoretical predictions match well with the experimental data in the whole delay time range.
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