Computer simulations of anodic dissolution in Cu-Au-Pd ternary alloys

M. Nakagawa, T. Shiraishi, S. Matsuya, M. Ohta

研究成果: ジャーナルへの寄稿記事

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抜粋

Computer simulation experiments were performed for the anodic dissolution process of Cu0.7Au0.3-xPdx (x=0-0.3) alloys. Dissolution probabilities of constituents which represented the dissolution rate were defined by considering the standard electrode potential of the dissolution reaction and atomic interaction between Cu and the other atoms. The simulation results qualitatively reproduced the experimental results of anodic potentiostatic polarization tests regarding the dependence of the anodic dissolution behaviour on the polarization potential and the alloy composition, and the atomic concentration depth profile of the constituents after anodic polarization. Atomic interaction among the constituents of an alloy was found to be one of the important factors which control the anodic dissolution features of the alloys.

元の言語英語
ページ(範囲)1199-1204
ページ数6
ジャーナルJournal of Materials Science
28
発行部数5
DOI
出版物ステータス出版済み - 3 1 1993

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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