Controllable CMP of oxide film by using colloidal ceria slurry

Syuhei Kurokawa, Takaaki Toyama, Terutake Hayashi, Eisaku Suda, Jun Tokuda

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

4 被引用数 (Scopus)

抄録

Colloidal ceria slurry is expected to be a candidate of alternative slurry for oxide film CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Due to the small diameter of the particles, removal rate(RR) tends to be smaller than that of calcined ceria slurry. To improve the RR, KOH additive was mixed to the slurry and the influence of KOH concentration was investigated. The result showing RR transition and dramatic improvement of RR close to that of calcined ceria slurry has been obtained. Even in the high RR, surface roughness of the substrate was kept almost constant in good level. To investigate the mechanism of the RR improvement, SEM images of particles in different states were captured. Original colloidal ceria particles have a polyhedral shape close to spherical one. With KOH additive, particles aggregated but the strength of aggregation was apparently different in different KOH concentrations. The aggregation was quite strong over 0.1mol/L concentration of KOH, and the RR improvement strongly relates to the aggregation state. Although the aggregated particle size was comparable to the calcined ceria particle size, the surface roughness was better than that of calcined ceria slurry.

本文言語英語
ホスト出版物のタイトルICPT 2017 - International Conference on Planarization/CMP Technology
出版社VDE Verlag GmbH
ページ177-182
ページ数6
ISBN(電子版)9783800744626
出版ステータス出版済み - 2017
イベント2017 International Conference on Planarization/CMP Technology, ICPT 2017 - Leuven, ベルギー
継続期間: 10月 11 201710月 13 2017

出版物シリーズ

名前ICPT 2017 - International Conference on Planarization/CMP Technology

会議

会議2017 International Conference on Planarization/CMP Technology, ICPT 2017
国/地域ベルギー
CityLeuven
Period10/11/1710/13/17

!!!All Science Journal Classification (ASJC) codes

  • プロセス化学およびプロセス工学
  • 電子材料、光学材料、および磁性材料

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