Copper-filled through-hole electrode of a ZnS window material for sealing a thermal infrared sensor

Takafumi Fukumoto, Naoki Okamoto, Yoshimi Ohta, Yasuhiro Fukuyama, masaki Hirota, Kazuo Kondo

研究成果: ジャーナルへの寄稿記事

抄録

The through-hole electrode for the wafer level package (WLP) was formed with the aim of lowering the cost of infrared sensors. It has been difficult to plate a ZnS substrate for use as the window material of WLPs because of low adhesion. However, through-hole filling was successfully accomplished in this work by applying a newly developed method of direct nonelectrolyte plating. Concretely, a blast cleaning process was performed on a ZnS substrate of 1 mm thickness. Then, a through-hole with both sides tapered was formed with an aspect ratio of 7. A compound process of Cu substitution plating and Ni nonelectrolyte plating was applied to the through-hole, forming a uniform plating film with high adhesion in the hole. Finally, the through-hole was completely filled by Cu electroplating. A He leak test confirmed that the sample had high sealing properties, with a measured leak rate of 1.0 × 10 -10 Pa·m3/sec or less. The results showed that a ZnS substrate can be used effectively for IR window material, making it possible to reduce the cost of infrared cameras.

元の言語英語
ジャーナルIEEJ Transactions on Sensors and Micromachines
130
発行部数9
DOI
出版物ステータス出版済み - 11 9 2010

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Plating
Infrared radiation
Copper
Electrodes
Sensors
Blast cleaning
Substrates
Adhesion
Electroplating
Costs
Aspect ratio
Substitution reactions
Cameras
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

これを引用

Copper-filled through-hole electrode of a ZnS window material for sealing a thermal infrared sensor. / Fukumoto, Takafumi; Okamoto, Naoki; Ohta, Yoshimi; Fukuyama, Yasuhiro; Hirota, masaki; Kondo, Kazuo.

:: IEEJ Transactions on Sensors and Micromachines, 巻 130, 番号 9, 09.11.2010.

研究成果: ジャーナルへの寄稿記事

Fukumoto, Takafumi ; Okamoto, Naoki ; Ohta, Yoshimi ; Fukuyama, Yasuhiro ; Hirota, masaki ; Kondo, Kazuo. / Copper-filled through-hole electrode of a ZnS window material for sealing a thermal infrared sensor. :: IEEJ Transactions on Sensors and Micromachines. 2010 ; 巻 130, 番号 9.
@article{99f338454c484edcb1980e11270e9948,
title = "Copper-filled through-hole electrode of a ZnS window material for sealing a thermal infrared sensor",
abstract = "The through-hole electrode for the wafer level package (WLP) was formed with the aim of lowering the cost of infrared sensors. It has been difficult to plate a ZnS substrate for use as the window material of WLPs because of low adhesion. However, through-hole filling was successfully accomplished in this work by applying a newly developed method of direct nonelectrolyte plating. Concretely, a blast cleaning process was performed on a ZnS substrate of 1 mm thickness. Then, a through-hole with both sides tapered was formed with an aspect ratio of 7. A compound process of Cu substitution plating and Ni nonelectrolyte plating was applied to the through-hole, forming a uniform plating film with high adhesion in the hole. Finally, the through-hole was completely filled by Cu electroplating. A He leak test confirmed that the sample had high sealing properties, with a measured leak rate of 1.0 × 10 -10 Pa·m3/sec or less. The results showed that a ZnS substrate can be used effectively for IR window material, making it possible to reduce the cost of infrared cameras.",
author = "Takafumi Fukumoto and Naoki Okamoto and Yoshimi Ohta and Yasuhiro Fukuyama and masaki Hirota and Kazuo Kondo",
year = "2010",
month = "11",
day = "9",
doi = "10.1541/ieejsmas.130.437",
language = "English",
volume = "130",
journal = "IEEJ Transactions on Sensors and Micromachines",
issn = "1341-8939",
publisher = "The Institute of Electrical Engineers of Japan",
number = "9",

}

TY - JOUR

T1 - Copper-filled through-hole electrode of a ZnS window material for sealing a thermal infrared sensor

AU - Fukumoto, Takafumi

AU - Okamoto, Naoki

AU - Ohta, Yoshimi

AU - Fukuyama, Yasuhiro

AU - Hirota, masaki

AU - Kondo, Kazuo

PY - 2010/11/9

Y1 - 2010/11/9

N2 - The through-hole electrode for the wafer level package (WLP) was formed with the aim of lowering the cost of infrared sensors. It has been difficult to plate a ZnS substrate for use as the window material of WLPs because of low adhesion. However, through-hole filling was successfully accomplished in this work by applying a newly developed method of direct nonelectrolyte plating. Concretely, a blast cleaning process was performed on a ZnS substrate of 1 mm thickness. Then, a through-hole with both sides tapered was formed with an aspect ratio of 7. A compound process of Cu substitution plating and Ni nonelectrolyte plating was applied to the through-hole, forming a uniform plating film with high adhesion in the hole. Finally, the through-hole was completely filled by Cu electroplating. A He leak test confirmed that the sample had high sealing properties, with a measured leak rate of 1.0 × 10 -10 Pa·m3/sec or less. The results showed that a ZnS substrate can be used effectively for IR window material, making it possible to reduce the cost of infrared cameras.

AB - The through-hole electrode for the wafer level package (WLP) was formed with the aim of lowering the cost of infrared sensors. It has been difficult to plate a ZnS substrate for use as the window material of WLPs because of low adhesion. However, through-hole filling was successfully accomplished in this work by applying a newly developed method of direct nonelectrolyte plating. Concretely, a blast cleaning process was performed on a ZnS substrate of 1 mm thickness. Then, a through-hole with both sides tapered was formed with an aspect ratio of 7. A compound process of Cu substitution plating and Ni nonelectrolyte plating was applied to the through-hole, forming a uniform plating film with high adhesion in the hole. Finally, the through-hole was completely filled by Cu electroplating. A He leak test confirmed that the sample had high sealing properties, with a measured leak rate of 1.0 × 10 -10 Pa·m3/sec or less. The results showed that a ZnS substrate can be used effectively for IR window material, making it possible to reduce the cost of infrared cameras.

UR - http://www.scopus.com/inward/record.url?scp=78049435343&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78049435343&partnerID=8YFLogxK

U2 - 10.1541/ieejsmas.130.437

DO - 10.1541/ieejsmas.130.437

M3 - Article

AN - SCOPUS:78049435343

VL - 130

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

SN - 1341-8939

IS - 9

ER -