Cu-filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film

Naoki Okamoto, Megumi Miyamoto, Takeyasu Saito, Kazuo Kondo, Takafumi Fukumoto, masaki Hirota

研究成果: ジャーナルへの寄稿記事

3 引用 (Scopus)

抄録

Zinc sulfide (ZnS) and related materials are important for applications in ultraviolet light emitting diodes, cathode ray tubes, flat panel displays and infrared ray (IR) windows. In order to utilize these optoelectronics devices in electronic products, 3D-packaging as well as wafer level packaging (WLP) are needed. The two methods used to achieve this are physical vapor deposition (PVD) and conventional electroless deposition processes. However, both these methods have problems. Films made by PVD are not always of uniform thickness if the substrate is not flat. On the other hand, films made by conventional electroless deposition have weak adhesive strength to substrates. In order to overcome these limitations, we developed a new electroless deposition process to form nickel-phosphorus (Ni-P) films. This process combines catalyzation (Cu deposition) and electroless deposition processes. The films made using the new process show high adhesive strength in tensile tests and also very uniform thickness. In addition, conformal Cu filling of through-holes was achieved by using this new electroless deposition process.

元の言語英語
ページ(範囲)363-366
ページ数4
ジャーナルElectrochimica Acta
82
DOI
出版物ステータス出版済み - 11 1 2012
外部発表Yes

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Zinc sulfide
Electroless plating
Nickel
Phosphorus
Adhesives
Thin films
Electrodes
Physical vapor deposition
Packaging
Flat panel displays
Cathode ray tubes
Substrates
Optoelectronic devices
Light emitting diodes
zinc sulfide
Infrared radiation

All Science Journal Classification (ASJC) codes

  • Electrochemistry
  • Chemical Engineering(all)

これを引用

Cu-filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film. / Okamoto, Naoki; Miyamoto, Megumi; Saito, Takeyasu; Kondo, Kazuo; Fukumoto, Takafumi; Hirota, masaki.

:: Electrochimica Acta, 巻 82, 01.11.2012, p. 363-366.

研究成果: ジャーナルへの寄稿記事

Okamoto, Naoki ; Miyamoto, Megumi ; Saito, Takeyasu ; Kondo, Kazuo ; Fukumoto, Takafumi ; Hirota, masaki. / Cu-filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film. :: Electrochimica Acta. 2012 ; 巻 82. pp. 363-366.
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AU - Hirota, masaki

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