Cyclic creep behavior of SiCw/6061Al composites at high temperatures

P. L. Liu, Z. G. Wang, H. Toda, T. Kobayashi

研究成果: Contribution to journalArticle査読

抄録

The tensile creep and tensile-tensile cyclic creep behavior of 15 vol % and 28 vol % SiCw/6061 Al composites at different temperatures has been investigated and analyzed. The comparison between cyclic and static creep behavior indicates that the cyclic creep acceleration behavior is more likely to take place at lower temperatures. It is also found that the unloading amount affects the minimum creep rate significantly at the tested temperatures. The minimum cyclic creep rate decreases first and then increases with increasing the unloading amount. The unloading amount corresponding to the turning point of the minimum cyclic creep rates increases with increasing the temperature. Based on the concept of the back movement of dislocations during unloading portion, this result can be explained.

本文言語英語
ページ(範囲)655-660
ページ数6
ジャーナルKey Engineering Materials
149 PART II
出版ステータス出版済み - 12 1 1998
外部発表はい

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 材料力学
  • 機械工学

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