Deformation and fracture of Cu-SiO2 bicrystals with [011] twist boundaries

Hiromi Miura, Taku Sakai, Hiroyuki Toda

研究成果: Contribution to journalArticle査読

8 被引用数 (Scopus)

抄録

Several kinds of Cu-SiO2 bicrystals having [011] twist boundaries with different misorientation angles were tensile tested at various temperatures from 473-1023 K at strain rates from 4.2 × 10 -5-4.2 × 10-3 s-1 in vacuum. Most of bicrystals fractured intergranularly. The grain-boundary strength and fracture behavior of the Cu-SiO2 bicrystals strongly depended on the grain-boundary character, temperature and strain rate. As the misorientation angle or grain-boundary energy increases, grain-boundary fracture takes place more easily at lower temperatures with lower fracture stresses. Furthermore, fracture stress and elongation to fracture decrease almost monotonically with increasing temperature and decreasing strain rate. The observed grain-boundary character and test condition dependence of grain-boundary strength can be understood reasonably by considering the occurrence of stress-concentration sites around the grain-boundary SiO2 particles to form voids and cracks caused by grain-boundary sliding.

本文言語英語
ページ(範囲)4707-4717
ページ数11
ジャーナルActa Materialia
51
16
DOI
出版ステータス出版済み - 9 15 2003
外部発表はい

All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • セラミックおよび複合材料
  • ポリマーおよびプラスチック
  • 金属および合金

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