Development of a high efficiency polishing technology using abrasive control technique with AC electric field for glass substrates - Effect of an AC electric field on slurry behavior and polishing characteristics

Hiroshi Ikeda, Yoichi Akagami, Michio Uneda, Osamu Ohnishi, Syuhei Kurokawa, Toshiro K. Doi

研究成果: ジャーナルへの寄稿記事

抄録

This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12%. Polishing rate also increased 22% compared to the conventional polishing when AC electric field was applied. This will contribute to the reduction of the consumption of the cerium oxide abrasives.

元の言語英語
ページ(範囲)1146-1150
ページ数5
ジャーナルSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
77
発行部数12
DOI
出版物ステータス出版済み - 1 1 2011

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Polishing
Abrasives
Electric fields
Glass
Substrates
Cerium
Oxides

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

これを引用

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AU - Kurokawa, Syuhei

AU - Doi, Toshiro K.

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