Development of advanced high heat flux cooling system for power electronics

Shinmoto Yasuhisa, Shinichi Miura, Koich Suzuki, Yoshiyuki Abe, Haruhiko Ohta

研究成果: 著書/レポートタイプへの貢献会議での発言

1 引用 (Scopus)

抄録

Recent development in electronic devices with increased heat dissipation requires severe cooling conditions and an efficient method for heat removal is needed for the cooling under high heat flux conditions. Most researches are concentrated on small semiconductors with high heat flux density, while almost no existing researches concerning the cooling of a large semiconductor, i.e. power electronics, with high heat generation density from a large cooling area. A narrow channel between parallel plates is one of ideal structures for the application of boiling phenomena which uses the cooling for such large semiconductors. To develop high-performance cooling systems for power electronics, experiments on increase in critical heat flux (CHF) for flow boiling in narrow channels by improved liquid supply was conducted. To realize the cooling of large areas at extremely high heat flux under the conditions for a minimum gap size and a minimum flow rate of liquid supplied, the structure with auxiliary liquid supply was devised to prevent the extension of dry-patches underneath flattened bubbles generated in a narrow channel. The heating surface was experimented in two channels with different dimensions. The heating surfaces have the width of 30mm and the lengths of 50mm and 150mm in the flow direction. A large width of actual power electronics is realizable by the parallel installation of the same channel structure in the transverse direction. The cooling liquid is additionally supplied via sintered metal plates from the auxiliary unheated channels located at sides or behind the main heated channel. To supply the liquid to the entire heating surface, fine grooves are machined on the heating surface for enhance the spontaneous liquid supply by the aid of capillary force. The gap size of narrow channels are varied as 0.7mm, 2mm and 5mm. Distribution of liquid flow rate to the main heated channel and the auxiliary unheated channels were varied to investigate its effect on the critical heat flux. Test liquids employed are R113, FC72 and water. The systematic experiments by using water as a test liquid were conducted. Critical heat flux values larger than 2×10 6 W/m 2 were obtained at both gap sizes of 2mm and 5mm for a heated length of 150mm. A very high heat transfer coefficient as much as 1×10 5 W/m 2 K was obtained at very high heat flux near CHF for the gap size of 2mm. This paper is a summary of experimental results obtained in the past by the present authors.

元の言語英語
ホスト出版物のタイトルProceedings of the ASME InterPack Conference 2009, IPACK2009
ページ283-292
ページ数10
DOI
出版物ステータス出版済み - 6 30 2010
イベント2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, 米国
継続期間: 7 19 20097 23 2009

出版物シリーズ

名前Proceedings of the ASME InterPack Conference 2009, IPACK2009
2

その他

その他2009 ASME InterPack Conference, IPACK2009
米国
San Francisco, CA
期間7/19/097/23/09

Fingerprint

Power electronics
Cooling systems
Heat flux
Liquids
Cooling
Heating
Semiconductor materials
Boiling liquids
Flow rate
Plate metal
Heat generation
Heat losses
Heat transfer coefficients
Water
Experiments

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Yasuhisa, S., Miura, S., Suzuki, K., Abe, Y., & Ohta, H. (2010). Development of advanced high heat flux cooling system for power electronics. : Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 283-292). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; 巻数 2). https://doi.org/10.1115/InterPACK2009-89082

Development of advanced high heat flux cooling system for power electronics. / Yasuhisa, Shinmoto; Miura, Shinichi; Suzuki, Koich; Abe, Yoshiyuki; Ohta, Haruhiko.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. 2010. p. 283-292 (Proceedings of the ASME InterPack Conference 2009, IPACK2009; 巻 2).

研究成果: 著書/レポートタイプへの貢献会議での発言

Yasuhisa, S, Miura, S, Suzuki, K, Abe, Y & Ohta, H 2010, Development of advanced high heat flux cooling system for power electronics. : Proceedings of the ASME InterPack Conference 2009, IPACK2009. Proceedings of the ASME InterPack Conference 2009, IPACK2009, 巻. 2, pp. 283-292, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, 米国, 7/19/09. https://doi.org/10.1115/InterPACK2009-89082
Yasuhisa S, Miura S, Suzuki K, Abe Y, Ohta H. Development of advanced high heat flux cooling system for power electronics. : Proceedings of the ASME InterPack Conference 2009, IPACK2009. 2010. p. 283-292. (Proceedings of the ASME InterPack Conference 2009, IPACK2009). https://doi.org/10.1115/InterPACK2009-89082
Yasuhisa, Shinmoto ; Miura, Shinichi ; Suzuki, Koich ; Abe, Yoshiyuki ; Ohta, Haruhiko. / Development of advanced high heat flux cooling system for power electronics. Proceedings of the ASME InterPack Conference 2009, IPACK2009. 2010. pp. 283-292 (Proceedings of the ASME InterPack Conference 2009, IPACK2009).
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