TY - GEN
T1 - Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics
AU - Shiozawa, Kousuke
AU - Sano, Yasuhisa
AU - Kurokawa, Syuhei
AU - Miyashita, Tadakazu
AU - Sumizawa, Haruo
AU - Doi, Toshiro
AU - Aida, Hideo
AU - Oyama, Koki
AU - Yamauchi, Kazuto
PY - 2015/1/20
Y1 - 2015/1/20
N2 - We propose a chemical mechanical polishing (CMP)/Plasma Chemical Vaporization Machining (P-CVM) fusion processing and developed basic type CMP/P-CVM fusion processing, which consists of mechanical polish part, P-CVM part, and sample holder moving between them. As a result of basic experiments using silicon carbide as a sample, it is found that Peak to valley of the surface profile can be reduced from 1500 nm to 200-300 nm by 40-times repetition of the mechanical polishing followed by P-CVM and the decrease rate of the height of the mesa structures by a CMP/P-CVM fusion processing is approximately 3.5 times larger than that of the mechanical polish.
AB - We propose a chemical mechanical polishing (CMP)/Plasma Chemical Vaporization Machining (P-CVM) fusion processing and developed basic type CMP/P-CVM fusion processing, which consists of mechanical polish part, P-CVM part, and sample holder moving between them. As a result of basic experiments using silicon carbide as a sample, it is found that Peak to valley of the surface profile can be reduced from 1500 nm to 200-300 nm by 40-times repetition of the mechanical polishing followed by P-CVM and the decrease rate of the height of the mesa structures by a CMP/P-CVM fusion processing is approximately 3.5 times larger than that of the mechanical polish.
UR - http://www.scopus.com/inward/record.url?scp=84925353130&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84925353130&partnerID=8YFLogxK
U2 - 10.1109/ICPT.2014.7017298
DO - 10.1109/ICPT.2014.7017298
M3 - Conference contribution
T3 - ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
SP - 275
EP - 278
BT - ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th International Conference on Planarization/CMP Technology, ICPT 2014
Y2 - 19 November 2014 through 21 November 2014
ER -