Development of high-temperature solders: Review

Guang Zeng, Stuart McDonald, Kazuhiro Nogita

研究成果: Contribution to journalReview article査読

215 被引用数 (Scopus)

抄録

The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research on suitable replacement alloys, as well as traditional Pb-Sn alloys, collating relevant properties and identifying areas where further development is required. The main candidate alloys covered are derived from the Au-Sn, Au-Ge, Zn-Al, Zn-Sn, Bi-Ag and Sn-Sb alloy systems. Each of these systems is discussed with respect to the advantages and disadvantages associated with their use in soldering applications. It is concluded that further development of alloys suitable for high-temperature lead-free soldering applications is required.

本文言語英語
ページ(範囲)1306-1322
ページ数17
ジャーナルMicroelectronics Reliability
52
7
DOI
出版ステータス出版済み - 7 2012

All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 安全性、リスク、信頼性、品質管理
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 電子工学および電気工学

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