TY - JOUR
T1 - Development of high-temperature solders
T2 - Review
AU - Zeng, Guang
AU - McDonald, Stuart
AU - Nogita, Kazuhiro
N1 - Funding Information:
We gratefully acknowledge financial support from the University of Queensland-Nihon Superior collaborative research program and support from an Australian Research Council Linkage grant LP100200250. Guang Zeng is financially supported by the University of Queensland International (UQI) Scholarship and China Scholarship Council (CSC) Scholarship.
Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012/7
Y1 - 2012/7
N2 - The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research on suitable replacement alloys, as well as traditional Pb-Sn alloys, collating relevant properties and identifying areas where further development is required. The main candidate alloys covered are derived from the Au-Sn, Au-Ge, Zn-Al, Zn-Sn, Bi-Ag and Sn-Sb alloy systems. Each of these systems is discussed with respect to the advantages and disadvantages associated with their use in soldering applications. It is concluded that further development of alloys suitable for high-temperature lead-free soldering applications is required.
AB - The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research on suitable replacement alloys, as well as traditional Pb-Sn alloys, collating relevant properties and identifying areas where further development is required. The main candidate alloys covered are derived from the Au-Sn, Au-Ge, Zn-Al, Zn-Sn, Bi-Ag and Sn-Sb alloy systems. Each of these systems is discussed with respect to the advantages and disadvantages associated with their use in soldering applications. It is concluded that further development of alloys suitable for high-temperature lead-free soldering applications is required.
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U2 - 10.1016/j.microrel.2012.02.018
DO - 10.1016/j.microrel.2012.02.018
M3 - Review article
AN - SCOPUS:84861817834
VL - 52
SP - 1306
EP - 1322
JO - Microelectronics and Reliability
JF - Microelectronics and Reliability
SN - 0026-2714
IS - 7
ER -