Development of novel groove patterns for CMP pad

Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Kiyoshi Seshimo, Hideo Aida

研究成果: 著書/レポートタイプへの貢献会議での発言

抄録

This study aims to develop the CMP pads that have new groove pattern as control the slurry flow. We have been proposed two type groove patterns as inflow type and outflow type. Here, it is well known that the slurry flow is remarkably important as both to use the slurry effectively and to reduction the slurry quantity consumed of CeO 2 abrasive that is one of rare metals. This paper describes the effect of groove pattern on the slurry flow from the observation image with high-speed camera. In particular, the slurry flow is quantitatively visualized by digital image processing. As a result, the several advantages of both proposed inflow type and outflow type show from a view point of slurry flow compared to the conventional XY-groove pad and No-groove pad.

元の言語英語
ホスト出版物のタイトルUltra-Precision Machining Technologies
ページ264-267
ページ数4
DOI
出版物ステータス出版済み - 4 30 2012
イベント8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011 - Hangzhou City, 中国
継続期間: 11 20 201111 22 2011

出版物シリーズ

名前Advanced Materials Research
497
ISSN(印刷物)1022-6680

その他

その他8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011
中国
Hangzhou City
期間11/20/1111/22/11

Fingerprint

High speed cameras
Abrasives
Image processing
Metals

All Science Journal Classification (ASJC) codes

  • Engineering(all)

これを引用

Yamazaki, T., Doi, T. K., Kurokawa, S., Ohnishi, O., Uneda, M., Seshimo, K., & Aida, H. (2012). Development of novel groove patterns for CMP pad. : Ultra-Precision Machining Technologies (pp. 264-267). (Advanced Materials Research; 巻数 497). https://doi.org/10.4028/www.scientific.net/AMR.497.264

Development of novel groove patterns for CMP pad. / Yamazaki, Tsutomu; Doi, Toshiro K.; Kurokawa, Syuhei; Ohnishi, Osamu; Uneda, Michio; Seshimo, Kiyoshi; Aida, Hideo.

Ultra-Precision Machining Technologies. 2012. p. 264-267 (Advanced Materials Research; 巻 497).

研究成果: 著書/レポートタイプへの貢献会議での発言

Yamazaki, T, Doi, TK, Kurokawa, S, Ohnishi, O, Uneda, M, Seshimo, K & Aida, H 2012, Development of novel groove patterns for CMP pad. : Ultra-Precision Machining Technologies. Advanced Materials Research, 巻. 497, pp. 264-267, 8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011, Hangzhou City, 中国, 11/20/11. https://doi.org/10.4028/www.scientific.net/AMR.497.264
Yamazaki T, Doi TK, Kurokawa S, Ohnishi O, Uneda M, Seshimo K その他. Development of novel groove patterns for CMP pad. : Ultra-Precision Machining Technologies. 2012. p. 264-267. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.497.264
Yamazaki, Tsutomu ; Doi, Toshiro K. ; Kurokawa, Syuhei ; Ohnishi, Osamu ; Uneda, Michio ; Seshimo, Kiyoshi ; Aida, Hideo. / Development of novel groove patterns for CMP pad. Ultra-Precision Machining Technologies. 2012. pp. 264-267 (Advanced Materials Research).
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