Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer

Ryoya Miyamoto, A. I.A. Galal, Haruichi Kanaya

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抜粋

This paper presents the development of an up conversion mixer for wireless transmitter application in a 0.18-μm CMOS technology. The designed up-conversion mixer input center frequency is 620MHz and the output is 2.4GHz and 5.2GHz, respectively, for white space of TV broadcast frequency (470∼710MHz) communication system. In this design, it is become available by constructing dual band filter using bonding wires and chip inductors. The mixer is designed using TSMC 0.18μm CMOS process. Circuit simulations and measurements had been performed. The proposed mixer has a simulated conversion gain of 15.5dB and 16.2dB, IIP3 of -3.35dBm and -1.76dBm, noise figure of 5.32dB and 5.32dB at 2.4GHz and 5.2GHz.

元の言語英語
ホスト出版物のタイトルProceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ページ199-202
ページ数4
ISBN(電子版)9781509043682
DOI
出版物ステータス出版済み - 2 21 2017
イベント18th IEEE Electronics Packaging Technology Conference, EPTC 2016 - Singapore, シンガポール
継続期間: 11 30 201612 3 2016

出版物シリーズ

名前Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016

その他

その他18th IEEE Electronics Packaging Technology Conference, EPTC 2016
シンガポール
Singapore
期間11/30/1612/3/16

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

フィンガープリント Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Miyamoto, R., Galal, A. I. A., & Kanaya, H. (2017). Development of UHF to 2.4GHz and 5.2GHz dual band up-conversion CMOS mixer. : Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 (pp. 199-202). [7861471] (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2016.7861471