Diffusion barrier effect of TiC layer formed at the bonding interface and bonding characteristics of an explosively welded Ti/SUS420J1 stainless steel clad by heat treatment

Akira Chiba, Minoru Nishida, Yasuhiro Morizono, Kihatioru Imamura

研究成果: Contribution to journalArticle査読

1 被引用数 (Scopus)

抄録

The high temperature stability of an explosively welded Ti/SUS420J1 stainless steel clad was assessed by studying microstructures and bonding strengths of the clads with changing the annealing temperature. Compounds formed at their bonding interfaces consisted of TiC , FeTi, and/or Fe2Ti phases depending on the annealing conditions. The TiC layer formed at the boundary acts as an barrier for the diffusion of the base metals across the bonding interface under the 1000°C annealing and prevents the growth of intermetallic compounds, (FeTi and Fe2Ti) and of β-Ti. The specimens formed TiC layer at the bonding interface sustained high bonding strength even by high temperature annealing. Diffusion barrier effect diminished above 1050°C annealing due to the dissolution of TiC layer in γ matrix and the strength decreased. The diffusion barrier effect of the TiC layer was discussed on the basis of phase diagrams and physical properties of TiC compound.

本文言語英語
ページ(範囲)XI-53
ジャーナルTetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan
83
11
DOI
出版ステータス出版済み - 1997
外部発表はい

All Science Journal Classification (ASJC) codes

  • 凝縮系物理学
  • 物理化学および理論化学
  • 金属および合金
  • 材料化学

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