Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Takanori Shuto; Naoya Watanabe; Akihiro Ikeda; Takao Higashimachi; Tanemasa Asano

Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

集積電子システム

研究成果: 会議への寄与タイプ › 学会誌 › 査読

抄録

We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

本文言語	英語
ページ	1717-1720
ページ数	4
出版ステータス	出版済み - 12月 1 2010
イベント	17th International Display Workshops, IDW'10 - Fukuoka, 日本継続期間: 12月 1 2010 → 12月 3 2010

その他

その他	17th International Display Workshops, IDW'10
国/地域	日本
City	Fukuoka
Period	12/1/10 → 12/3/10

!!!All Science Journal Classification (ASJC) codes

コンピュータビジョンおよびパターン認識
人間とコンピュータの相互作用

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title = "Direct connection of LSI chips to polyethylene naphthalate using Au cone bump",

abstract = "We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.",

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AU - Shuto, Takanori

AU - Watanabe, Naoya

AU - Ikeda, Akihiro

AU - Higashimachi, Takao

AU - Asano, Tanemasa

PY - 2010/12/1

Y1 - 2010/12/1

N2 - We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

AB - We show that the direct connection of LSI chip to PEN (polyethylene naphthalate) film can be realized by using Au cone bump for flexible display. More than 10,000 connections at 20 μm pitch with low resistance can be realized at 150 °C.

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T2 - 17th International Display Workshops, IDW'10

Y2 - 1 December 2010 through 3 December 2010

ER -

Direct connection of LSI chips to polyethylene naphthalate using Au cone bump

抄録

その他

!!!All Science Journal Classification (ASJC) codes

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