Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds

Flora Somidin, Hiroshi Maeno, Takaaki Toriyama, Stuart D. McDonald, Wenhui Yang, Syo Matsumura, Kazuhiro Nogita

研究成果: ジャーナルへの寄稿記事

抄録

The polymorphic transformation in interfacial intermetallic compounds in three lead-free solder joints was investigated using in situ heating/isothermal/cooling observation techniques in high-voltage transmission electron microscopy (HVTEM). Here, the hexagonal η- to monoclinic η′-Cu6Sn5 polymorphic transformation was visualised systematically through zone-axis electron diffraction patterns and real-space imaging. Cu6Sn5 grains obtained in the as-reflowed solder joints that did not contain Ni (Sn–0.7Cu/Cu and Sn–3.0Ag–0.5Cu/Cu) show weak reflections in the diffraction patterns from the η′-Cu6Sn5. In Sn–0.7Cu–0.05Ni/Cu joints, no weak reflections were present in the diffraction patterns of the (Cu,Ni)6Sn5 grains indicating the presence of Ni prevented the η- to η′-Cu6Sn5 transformation. The movement of bend contours was also observed at around 186 °C in adjacent the grain boundaries in Cu6Sn5 but not in the (Cu,Ni)6Sn5. We also uncover the origin of the weak reflections and confirm the superstructure of monoclinic η′-Cu6Sn5 by obtaining atomic-resolution images within the areas from which the selected area diffraction patterns were obtained.

元の言語英語
記事番号100530
ジャーナルMaterialia
9
DOI
出版物ステータス出版済み - 3 2020

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Diffraction patterns
Intermetallics
Image resolution
Electron diffraction
Soldering alloys
Grain boundaries
Transmission electron microscopy
Cooling
Imaging techniques
Heating
Electric potential

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

これを引用

Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. / Somidin, Flora; Maeno, Hiroshi; Toriyama, Takaaki; McDonald, Stuart D.; Yang, Wenhui; Matsumura, Syo; Nogita, Kazuhiro.

:: Materialia, 巻 9, 100530, 03.2020.

研究成果: ジャーナルへの寄稿記事

Somidin, Flora ; Maeno, Hiroshi ; Toriyama, Takaaki ; McDonald, Stuart D. ; Yang, Wenhui ; Matsumura, Syo ; Nogita, Kazuhiro. / Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. :: Materialia. 2020 ; 巻 9.
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abstract = "The polymorphic transformation in interfacial intermetallic compounds in three lead-free solder joints was investigated using in situ heating/isothermal/cooling observation techniques in high-voltage transmission electron microscopy (HVTEM). Here, the hexagonal η- to monoclinic η′-Cu6Sn5 polymorphic transformation was visualised systematically through zone-axis electron diffraction patterns and real-space imaging. Cu6Sn5 grains obtained in the as-reflowed solder joints that did not contain Ni (Sn–0.7Cu/Cu and Sn–3.0Ag–0.5Cu/Cu) show weak reflections in the diffraction patterns from the η′-Cu6Sn5. In Sn–0.7Cu–0.05Ni/Cu joints, no weak reflections were present in the diffraction patterns of the (Cu,Ni)6Sn5 grains indicating the presence of Ni prevented the η- to η′-Cu6Sn5 transformation. The movement of bend contours was also observed at around 186 °C in adjacent the grain boundaries in Cu6Sn5 but not in the (Cu,Ni)6Sn5. We also uncover the origin of the weak reflections and confirm the superstructure of monoclinic η′-Cu6Sn5 by obtaining atomic-resolution images within the areas from which the selected area diffraction patterns were obtained.",
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AU - McDonald, Stuart D.

AU - Yang, Wenhui

AU - Matsumura, Syo

AU - Nogita, Kazuhiro

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