Mechanisms of enhancement of plastic deformation in TiAl responsible for ductility improvement of this material, have been studied by high-voltage electron microscopy (HVEM) and atom probe field ion microscopy (AP-FIM). During cross-twinning, a dislocation interaction occurs at twin boundaries. Dislocation networks and fine Ti3Al particles on the pre-existing twin boundaries promote the formation and movement of twinning partial dislocations, contributing to an improvement of ductility.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics