Dynamic recrystallization mechanisms operating under different processing conditions

Andrey Belyakov, Nadezhda Dudova, Marina Tikhonova, Taku Sakai, Kaneaki Tsuzaki, Rustam Kaibyshev

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

1 被引用数 (Scopus)

抄録

Dynamic recrystallization (DRX) is one of the most important mechanisms for microstructure evolution during deformation of various metals and alloys. So-called discontinuous DRX usually develops in structural materials with low to medium stacking fault energy during hot working. The local migration, i.e. bulging, of grain boundaries leads to the formation of recrystallization nuclei, which then grow out consuming work-hardened surroundings. The cyclic character of nucleation and growth of new grains during deformation results in a dynamically constant average grain size. The dynamic grain size is sensitively dependent on temperature and strain rate and can be expressed by a power law function of flow stress with a grain size exponent of about -0.7 under conditions of hot working. Recent studies on DRX phenomenon suggest that a decrease in deformation temperature changes the structural mechanism for new grain formation. As a result, the grain size exponent in the relationship between the dynamic grain size and flow stress approaches about -0.25 under warm working conditions.

本文言語英語
ホスト出版物のタイトルTHERMEC 2011
出版社Trans Tech Publications Ltd
ページ2704-2709
ページ数6
ISBN(印刷版)9783037853030
DOI
出版ステータス出版済み - 2012
外部発表はい
イベント7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011 - Quebec City, QC, カナダ
継続期間: 8 1 20118 5 2011

出版物シリーズ

名前Materials Science Forum
706-709
ISSN(印刷版)0255-5476
ISSN(電子版)1662-9752

その他

その他7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011
Countryカナダ
CityQuebec City, QC
Period8/1/118/5/11

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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