Dynamic recrystallization of electroformed copper liners of shaped charges in high-strain-rate plastic deformation

Wenhuai Tian, Hongye Gao, Ailing Fan, Xiaoou Shan, Qi Sun

研究成果: Contribution to journalArticle査読

5 被引用数 (Scopus)

抄録

The microstructures in the electroformed copper liners of shaped charges after the high-strain-rate plastic deformation were investigated by transmission electron microscopy (TEM). Meanwhile, the orientation distribution of the grains in the recovered slug was examined by the electron backscattering Kikuchi pattern (EBSP) technique. EBSP analysis illustrated that unlike the as-formed electro-formed copper liners of shaped charges the grain orientations in the recovered slug are distributed along randomly all the directions after undergoing heavy strain deformation at high-strain rate. Optical microscopy shows a typical recrystallization structure, and TEM examination reveals dislocation cells existed in the thin foil specimen. These results indicate that dynamic recovery and recrystallization occur during this plastic deformation process, and the associated deformation temperature is considered to be 0.6 times higher than the melting point of copper.

本文言語英語
ページ(範囲)343-346
ページ数4
ジャーナルJournal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)
9
5
出版ステータス出版済み - 10 2002
外部発表はい

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 地盤工学および土木地質学
  • 材料力学
  • 機械工学
  • 物理化学および理論化学
  • 金属および合金
  • 材料化学

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