Effect of argon/hydrogen plasma cleaning on electroless ni deposition on small-area al pads

Akihiro Ikeda, Kouhei Kajiwara, Naoya Watanabe, Tanemasa Asano

研究成果: ジャーナルへの寄稿学術誌査読

7 被引用数 (Scopus)

抄録

We investigated effect of Ar/H2 plasma cleaning on electroless Ni under-bump metallurgy (UBM) layer formation on small-area Al pads. When 5 × 5 μm2 pads are cleaned with the plasma, electroless Ni grows successfully on them, whereas no growth occurs on pads cleaned with conventional wet chemicals. In the Ni-UBM layer formation process, Zn is deposited by displacement plating on the Al pads before the electroless Ni plating. Microscopic observations, however, reveal that Zn is not successfully deposited on the wet-cleaned Al-pad surface. X-ray chemical analysis indicates that the plasma cleaning effectively removes C contaminations even for small pad sizes.

本文言語英語
論文番号08JA05
ジャーナルJapanese journal of applied physics
49
8 PART 2
DOI
出版ステータス出版済み - 8月 2010

!!!All Science Journal Classification (ASJC) codes

  • 工学(全般)
  • 物理学および天文学(全般)

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