Effect of Bi or Sb addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys

Masayuki Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, Shigeto Yamasaki, Masatoshi Mitsuhara, Hideharu Nakashima

研究成果: ジャーナルへの寄稿学術誌査読

抄録

Global concerns over the environmental impact and health effects of the lead-based solders have led to the development of lead-free solder alloys. Further improvements in the reliability of lead-free solder alloys at high temperatures are required for downsizing of electronic components in vehicles. In this work, tensile and creep tests and microstructure analysis were carried out to determine the effect of Bi or Sb addition on high-temperature deformation behavior in Sn-Cu-Ni solder alloys. The addition of Bi or Sb increased the strength of the Sn-Cu-Ni solder alloys. The stress exponent was estimated to be ≥3, indicating that the high- Temperature deformation was controlled by dislocation creep. Furthermore, in both the alloys, the stress exponent observed in the low stress region was nearly equal to 3 and discontinuously increased to ≥7 in the high stress region. For Sb addition, the solute atmosphere drag mechanism was observed in the low stress region.

本文言語英語
ページ(範囲)502-509
ページ数8
ジャーナルNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
81
11
DOI
出版ステータス出版済み - 9月 25 2017

!!!All Science Journal Classification (ASJC) codes

  • 凝縮系物理学
  • 材料力学
  • 金属および合金
  • 材料化学

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