Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects

Lijing Qiu, Akihiro Ikeda, Tanemasa Asano

研究成果: Contribution to journalReview article査読

3 被引用数 (Scopus)

抄録

The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

本文言語英語
論文番号068004
ジャーナルJapanese journal of applied physics
52
6 PART 1
DOI
出版ステータス出版済み - 6 1 2013

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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