Effect of fullerene poly-hydroxide on Cu-CMP process

Hirotaka Kishida, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo, Keisuke Suzuki

研究成果: Contribution to conferencePaper査読

1 被引用数 (Scopus)

抄録

A novel CMP process using poly-hydroxylated Mierene (C60(OH) 36) is proposed. It has been previously reported that a copper surface can be improved considerably using C60(OH)36 molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C60(OH)36 used for the CMP process is discussed. It was found that a copper-C60(OH)36 complex layer is formed by the reaction of hydrogen peroxide and C60(OH)36; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

本文言語英語
出版ステータス出版済み - 2009
外部発表はい
イベント5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 - Osaka, 日本
継続期間: 12 2 200912 4 2009

その他

その他5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009
Country日本
CityOsaka
Period12/2/0912/4/09

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

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