Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

M. A A Mohd Salleh, S. D. McDonald, C. M. Gourlay, S. A. Belyakov, H. Yasuda, K. Nogita

研究成果: Contribution to journalArticle査読

37 被引用数 (Scopus)

抄録

This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu6Sn5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu6Sn5 intermetallics, making them small. In contrast, without Ni, primary Cu6Sn5 intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu6Sn5. The results provide direct evidence of the sequence of events in the reaction of Ni-containing Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu6Sn5 intermetallic.

本文言語英語
ジャーナルJournal of Electronic Materials
DOI
出版ステータス受理済み/印刷中 - 10 22 2015
外部発表はい

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

フィンガープリント 「Effect of Ni on the Formation and Growth of Primary Cu<sub>6</sub>Sn<sub>5</sub> Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

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