TY - JOUR
T1 - Effect of Si substrate on interfacial SiO2 scavenging in HfO2/SiO2/Si stacks
AU - Li, Xiuyan
AU - Yajima, Takeaki
AU - Nishimura, Tomonori
AU - Nagashio, Kosuke
AU - Toriumi, Akira
N1 - Publisher Copyright:
© 2014 AIP Publishing LLC.
PY - 2014/11/3
Y1 - 2014/11/3
N2 - The scavenging kinetics of an ultra-thin SiO2 interface layer (SiO2-IL) in an HfO2/SiO2/Si stack is discussed by focusing on the substrate effect in addition to oxygen diffusion. 18O tracing experiments demonstrate that the O-atom moves from the SiO2-IL to the HfO2 layer during scavenging. SiO2-IL scavenging with various substrates (Si, SiC, and sapphire) has been found to be significantly different, which suggests that the Si in the substrate is also necessary to continuously cause the scavenging. Based on these findings and thermodynamic considerations, a kinetic model where oxygen vacancy (VO) transferred from the HfO2 reacts with the SiO2, which is in contact with the Si-substrate, is proposed for the SiO2-IL scavenging.
AB - The scavenging kinetics of an ultra-thin SiO2 interface layer (SiO2-IL) in an HfO2/SiO2/Si stack is discussed by focusing on the substrate effect in addition to oxygen diffusion. 18O tracing experiments demonstrate that the O-atom moves from the SiO2-IL to the HfO2 layer during scavenging. SiO2-IL scavenging with various substrates (Si, SiC, and sapphire) has been found to be significantly different, which suggests that the Si in the substrate is also necessary to continuously cause the scavenging. Based on these findings and thermodynamic considerations, a kinetic model where oxygen vacancy (VO) transferred from the HfO2 reacts with the SiO2, which is in contact with the Si-substrate, is proposed for the SiO2-IL scavenging.
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U2 - 10.1063/1.4901172
DO - 10.1063/1.4901172
M3 - Article
AN - SCOPUS:84908606717
SN - 0003-6951
VL - 105
JO - Applied Physics Letters
JF - Applied Physics Letters
IS - 18
M1 - 182902
ER -