Effect of stacking fault energy on deformation mechanisms in Cu and Cu-30% Zn alloy with gradient structure obtained by SMAT

Xiaomin Liu, Masashi Nakatani, Hongliang Gao, Bhupendra Sharma, Hongjiang Pan, Zhengrong Fu, Xingfu Li, Kei Ameyama, Xinkun Zhu

研究成果: Contribution to journalArticle査読

2 被引用数 (Scopus)

抄録

The deformation mechanism and mechanical properties of pure copper and copper-zinc alloys with low stacking fault energy (SFE) were investigated primarily. In this paper, pure Cu and Cu-30%Zn samples were processed by surface mechanical attrition treatment (SMAT) at cryogenic temperature. The results show that Cu-30%Zn samples exhibit higher yield strength and better ductility by tensile tests at room temperature. With the same processing time of SMAT, the SMAT-ed Cu-30%Zn samples exhibit an optimized combination of strength and ductility compared with that of the SMAT-ed Cu samples. The in-situ electron backscatter diffraction (EBSD) tests show that there is a high density of geometrically necessary dislocations (GNDs) in SMAT-ed Cu-30%Zn samples with low SFE, thereby forming a strong hetero-deformation induced (HDI) stress strengthening and HDI hardening. Also, the twins promote the accumulation of geometrically necessary dislocations to enhance strength while maintaining good ductility in the Cu − 30%Zn samples.

本文言語英語
論文番号158863
ジャーナルJournal of Alloys and Compounds
865
DOI
出版ステータス出版済み - 6 5 2021
外部発表はい

All Science Journal Classification (ASJC) codes

  • 材料力学
  • 機械工学
  • 金属および合金
  • 材料化学

フィンガープリント

「Effect of stacking fault energy on deformation mechanisms in Cu and Cu-30% Zn alloy with gradient structure obtained by SMAT」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル