Phosphorus (P) is often added to wave-solder baths as an anti-oxidation agent for older generation eutectic Sn-37wt%Pb solders. For Pb-free solder alloys trace amounts of germanium (Ge) have been added successfully in Sn-0.7wt%Cu-0.05wt%Ni for anti-oxidation purposes during the wave soldering process. Despite this practice, there is little information on how P and Ge distribute in solder alloys and dross in this alloy system. In this paper, the effects of combinations of trace levels of Ge (< 100ppm) and P (< 100ppm) in Sn-Cu-Ni solder alloys and their dross has been investigated by XRD and SEM/EDS. It was found that the weight fraction of tin oxides in the dross is increased with an addition of less than 100ppm P. The dross consists on SnO oxide with Sn in samples containing Ge and no P, while SnO and SnO2 oxide are both present when P and Ge additions are made. In samples containing P, (Cu,Ni)6Sn5 and Ni-P and/or Ni-Sn-P intermetallics particles were found.