Electrodeposition of Sn-Ag alloys and evaluation of connection reliability for automotive connectors

Hiroaki Nakano, Satoshi Oue, Masaaki Uranaka, Masataka Masuda, Hisaaki Fukushima, Yoshifumi Saka, Shigeru Sawada, Yasuhiro Hattori

研究成果: ジャーナルへの寄稿記事

8 引用 (Scopus)

抄録

Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 A·m-2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag+ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of an Ag3Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.

元の言語英語
ページ(範囲)712-719
ページ数8
ジャーナルMaterials Transactions
51
発行部数4
DOI
出版物ステータス出版済み - 4 1 2010

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connectors
Electrodeposition
electrodeposition
evaluation
Iodides
iodides
Sulfates
sulfates
Contact resistance
contact resistance
plating
Plating
Deposits
deposits
phase diagrams
Thiourea
Thioureas
abrasion
thioureas
Precious metals

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Electrodeposition of Sn-Ag alloys and evaluation of connection reliability for automotive connectors. / Nakano, Hiroaki; Oue, Satoshi; Uranaka, Masaaki; Masuda, Masataka; Fukushima, Hisaaki; Saka, Yoshifumi; Sawada, Shigeru; Hattori, Yasuhiro.

:: Materials Transactions, 巻 51, 番号 4, 01.04.2010, p. 712-719.

研究成果: ジャーナルへの寄稿記事

Nakano, Hiroaki ; Oue, Satoshi ; Uranaka, Masaaki ; Masuda, Masataka ; Fukushima, Hisaaki ; Saka, Yoshifumi ; Sawada, Shigeru ; Hattori, Yasuhiro. / Electrodeposition of Sn-Ag alloys and evaluation of connection reliability for automotive connectors. :: Materials Transactions. 2010 ; 巻 51, 番号 4. pp. 712-719.
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