抄録
Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 A·m-2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag+ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of an Ag3Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.
| 元の言語 | 英語 |
|---|---|
| ページ（範囲） | 712-719 |
| ページ数 | 8 |
| ジャーナル | Materials Transactions |
| 巻 | 51 |
| 発行部数 | 4 |
| DOI | |
| 出版物ステータス | 出版済み - 4 1 2010 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
これを引用
Electrodeposition of Sn-Ag alloys and evaluation of connection reliability for automotive connectors. / Nakano, Hiroaki; Oue, Satoshi; Uranaka, Masaaki; Masuda, Masataka; Fukushima, Hisaaki; Saka, Yoshifumi; Sawada, Shigeru; Hattori, Yasuhiro.
：: Materials Transactions, 巻 51, 番号 4, 01.04.2010, p. 712-719.研究成果: ジャーナルへの寄稿 › 記事
}
TY - JOUR
T1 - Electrodeposition of Sn-Ag alloys and evaluation of connection reliability for automotive connectors
AU - Nakano, Hiroaki
AU - Oue, Satoshi
AU - Uranaka, Masaaki
AU - Masuda, Masataka
AU - Fukushima, Hisaaki
AU - Saka, Yoshifumi
AU - Sawada, Shigeru
AU - Hattori, Yasuhiro
PY - 2010/4/1
Y1 - 2010/4/1
N2 - Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 A·m-2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag+ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of an Ag3Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.
AB - Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 A·m-2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag+ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of an Ag3Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.
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U2 - 10.2320/matertrans.M2009425
DO - 10.2320/matertrans.M2009425
M3 - Article
VL - 51
SP - 712
EP - 719
JO - Materials Transactions
JF - Materials Transactions
SN - 0916-1821
IS - 4
ER -