抄録
Electrodeposition behavior of Sn-Ag alloys was investigated at 1 to 1000 A/m 2 in both sulfate and pyrophosphate-iodide baths of 298 K, and the contact resistance of Sn-Ag alloys deposited on Cu connector was evaluated. In both baths, Ag behaved as more noble metal than Sn, showing the typical feature of regular type codeposition. The difference of deposition potential between Ag and Sn was 0.4 V in pyrophosphate-iodide bath, while it was 0.2 V in sulfate bath containing thiourea as complexing agent for Ag + ions. The deposits obtained from pyrophosphate-iodide bath consisted of blocks of a few micron in size, while those from sulfate bath showed grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of Ag 3Sn metallic compound and Sn in accordance with the equilibrium phase diagram of binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys after heating at 433 K for 120 hours was somewhat smaller at Ag contents less than 45 mass% than that of reflow Sn plating. The connecting reliability of connector after abrasion was better in deposited films of Sn-Ag alloys than in reflow Sn plating.
| 元の言語 | 英語 |
|---|---|
| ページ（範囲） | 622-629 |
| ページ数 | 8 |
| ジャーナル | Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals |
| 巻 | 73 |
| 発行部数 | 8 |
| DOI | |
| 出版物ステータス | 出版済み - 8 1 2009 |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys
- Materials Chemistry
これを引用
Electrodeposition of Sn-Ag alloys and its connecting reliability for automotive connectors. / Nakano, Hiroaki; Oue, Satoshi; Uranaka, Masaaki; Masuda, Masataka; Fukushima, Hisaaki; Saka, Yoshifumi; Sawada, Shigeru; Hattori, Yasuhiro.
：: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, 巻 73, 番号 8, 01.08.2009, p. 622-629.研究成果: ジャーナルへの寄稿 › 記事
}
TY - JOUR
T1 - Electrodeposition of Sn-Ag alloys and its connecting reliability for automotive connectors
AU - Nakano, Hiroaki
AU - Oue, Satoshi
AU - Uranaka, Masaaki
AU - Masuda, Masataka
AU - Fukushima, Hisaaki
AU - Saka, Yoshifumi
AU - Sawada, Shigeru
AU - Hattori, Yasuhiro
PY - 2009/8/1
Y1 - 2009/8/1
N2 - Electrodeposition behavior of Sn-Ag alloys was investigated at 1 to 1000 A/m 2 in both sulfate and pyrophosphate-iodide baths of 298 K, and the contact resistance of Sn-Ag alloys deposited on Cu connector was evaluated. In both baths, Ag behaved as more noble metal than Sn, showing the typical feature of regular type codeposition. The difference of deposition potential between Ag and Sn was 0.4 V in pyrophosphate-iodide bath, while it was 0.2 V in sulfate bath containing thiourea as complexing agent for Ag + ions. The deposits obtained from pyrophosphate-iodide bath consisted of blocks of a few micron in size, while those from sulfate bath showed grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of Ag 3Sn metallic compound and Sn in accordance with the equilibrium phase diagram of binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys after heating at 433 K for 120 hours was somewhat smaller at Ag contents less than 45 mass% than that of reflow Sn plating. The connecting reliability of connector after abrasion was better in deposited films of Sn-Ag alloys than in reflow Sn plating.
AB - Electrodeposition behavior of Sn-Ag alloys was investigated at 1 to 1000 A/m 2 in both sulfate and pyrophosphate-iodide baths of 298 K, and the contact resistance of Sn-Ag alloys deposited on Cu connector was evaluated. In both baths, Ag behaved as more noble metal than Sn, showing the typical feature of regular type codeposition. The difference of deposition potential between Ag and Sn was 0.4 V in pyrophosphate-iodide bath, while it was 0.2 V in sulfate bath containing thiourea as complexing agent for Ag + ions. The deposits obtained from pyrophosphate-iodide bath consisted of blocks of a few micron in size, while those from sulfate bath showed grains smaller than 1 μm. The deposits containing Ag less than 45 mass% were composed of Ag 3Sn metallic compound and Sn in accordance with the equilibrium phase diagram of binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys after heating at 433 K for 120 hours was somewhat smaller at Ag contents less than 45 mass% than that of reflow Sn plating. The connecting reliability of connector after abrasion was better in deposited films of Sn-Ag alloys than in reflow Sn plating.
UR - http://www.scopus.com/inward/record.url?scp=70349619909&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349619909&partnerID=8YFLogxK
U2 - 10.2320/jinstmet.73.622
DO - 10.2320/jinstmet.73.622
M3 - Article
AN - SCOPUS:70349619909
VL - 73
SP - 622
EP - 629
JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
SN - 0021-4876
IS - 8
ER -