Electron microscopy analysis of crack propagation behavior of alumina

H. Matsuo, M. Mitsuhara, K. Ikeda, S. Hata, H. Nakashima

研究成果: Chapter in Book/Report/Conference proceeding › Conference contribution

抜粋

Macroscopic features of crack propagation behavior in polycrystalline alumina (poly-alumina) and alumina single crystals (single-alumina) were analyzed by scanning electron microscopic electron back-scattered diffraction (SEM-EBSD) analysis. It was revealed that the intergranular fracture behavior is independent on grain boundary characters. When the cracks are propagated in the grains of poly- or single-alumina, zigzag cracks were produced. The zigzag cracks are composed of fracture surfaces formed along the cleavage planes. Microscopic features of fracture surfaces formed in a single-alumina were observed in detail by electron tomography combined with high-angle annular dark-field scanning transmission electron microscopy (HAADF-STEM). It was by visualized that the zigzag cracks were composed of flat and uneven fracture surfaces at a nm scale. The flat fracture surfaces and uneven ones were nearly parallel to the cleavage plane, {11̄02}, and the basal plane, {0001}, respectively.

元の言語英語
ホスト出版物のタイトルMaterials Science and Technology Conference and Exhibition MS and T'08
ページ753-761
ページ数9
出版物ステータス出版済み - 12 1 2008
イベントMaterials Science and Technology Conference and Exhibition, MS and T'08 - Pittsburgh, PA, 米国
継続期間: 10 5 2008 → 10 9 2008

出版物シリーズ

名前Materials Science and Technology Conference and Exhibition, MS and T'08
巻2

その他

その他Materials Science and Technology Conference and Exhibition, MS and T'08
国米国
市Pittsburgh, PA
期間10/5/08 → 10/9/08

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials

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    • これを引用

    Matsuo, H., Mitsuhara, M., Ikeda, K., Hata, S., & Nakashima, H. (2008). Electron microscopy analysis of crack propagation behavior of alumina. ： Materials Science and Technology Conference and Exhibition MS and T'08 (pp. 753-761). (Materials Science and Technology Conference and Exhibition, MS and T'08; 巻数 2).