Microstructure in a high-density MgB2 wire fabricated by an internal Mg diffusion (IMD) process has been investigated by electron microscopy imaging and analysis at different scales. In the IMD process, a pure Mg rod was used as Mg source, and nanosized SiC powders were mixed with amorphous B powders. In the case of a heat treatment at 640 °C for 1 h carried out after rolling and drawing processes, the wire has two microstructural features that degrade critical current density: uncrystallized zones composed mainly of unreacted B and SiC powders, and cracks partly filled with course Mg 2Si crystals. Those cracks were formed in the uncrystallized zones as well as in crystallized MgB2 zones. It indicate that the cracks formed by the mechanical milling and drawing remain after the heat treatment.
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