Electrostatic inkjet pattern formation was carried out using Si-needle inkjet head. The head was fabricated by preparing the Si needle using anodization of Si(100) with pn-junction at the surface and transferring the needle to another Si substrate using direct bonding technique. The printed pattern was observed with an optical microscope. The line width decreased with increasing the scanning velocity. The fine patterning technology was expected to facilitate the application of the liquid ejection technology to various electronic devices.
|ホスト出版物のタイトル||Digest of Papers - Microprocesses and Nanotechnology 2004|
|出版ステータス||出版済み - 2004|
|イベント||2004 International Microprocesses and Nanotechnology Conference - Osaka, 日本|
継続期間: 10 26 2004 → 10 29 2004
|その他||2004 International Microprocesses and Nanotechnology Conference|
|Period||10/26/04 → 10/29/04|
All Science Journal Classification (ASJC) codes