Evalution of drop strength due to thermal degradation for BGA-IC package

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

研究成果: Contribution to journalReview article査読

抄録

The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.

本文言語英語
ページ(範囲)186-191
ページ数6
ジャーナルNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
72
2
DOI
出版ステータス出版済み - 1 1 2006

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 材料力学
  • 機械工学

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