Experimental investigation of wireless energy harvesting with a Bluetooth low energy sensing unit

Mohamed M. Mansour, Osamu Takiguchi, Takayuki Inoi, Haruichi Kanaya

研究成果: 著書/レポートタイプへの貢献会議での発言

3 引用 (Scopus)

抜粋

In this presentation, we introduce an experimental demonstration for wireless energy harvesting application. Bluetooth low energy (BLE) unit connected to an array of sensors is used in conjunction with the proposed RF wireless rectenna. The rectenna is composed of a circularly polarized spiral antenna and a microstrip RF voltage doubler rectifier. The scheme shows a constant voltage charge of a super-capacitor (0.1pF) within the voltage limits of optimum BLE operation. The temperature and humidity sensing system was tested in real operation for more than 20 hours. The delivered voltage was maintained over 2.7 V that corresponds to the proper operating voltage of the BLE.

元の言語英語
ホスト出版物のタイトル2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ189-193
ページ数5
ISBN(電子版)9784990218850
DOI
出版物ステータス出版済み - 6 6 2018
イベント2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, 日本
継続期間: 4 17 20184 21 2018

出版物シリーズ

名前2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

その他

その他2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
日本
Kuwana, Mie
期間4/17/184/21/18

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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  • これを引用

    Mansour, M. M., Takiguchi, O., Inoi, T., & Kanaya, H. (2018). Experimental investigation of wireless energy harvesting with a Bluetooth low energy sensing unit. : 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 (pp. 189-193). (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2018.8374700