Experimental study of electron-phonon coupling factor of copper thin film

Wei Gang Ma, Haidong Wang, Xing Zhang, Zeng Yuan Guo

研究成果: ジャーナルへの寄稿記事

抜粋

Metallic thin wires are widely used as interconnectors in the ultra-miniature and highly-integrated systems and expected to exhibit high heat conductance. While in the development of novel photoelectric material, the coupling between electrons and phonons should be reduced as much as possible. The electron-phonon coupling is dominant to energy exchange in metals and the interaction time is in the order of femto to picoseconds. In this paper, the electron-phonon coupling factor of a copper nanofilm with thickness 60 nm deposited on the silicon substrate is measured using the transient thermoreflectance technique. The measured coupling factor is (11~12)×1016 W/(m3K) and very closed to the theoretical value 14×1016 W/(m3K).

元の言語英語
ページ(範囲)499-502
ページ数4
ジャーナルKung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
31
発行部数3
出版物ステータス出版済み - 3 1 2010

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering

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