Experimental study of electron-phonon coupling factor of copper thin film

Wei Gang Ma, Haidong Wang, Xing Zhang, Zeng Yuan Guo

研究成果: Contribution to journalArticle査読

抄録

Metallic thin wires are widely used as interconnectors in the ultra-miniature and highly-integrated systems and expected to exhibit high heat conductance. While in the development of novel photoelectric material, the coupling between electrons and phonons should be reduced as much as possible. The electron-phonon coupling is dominant to energy exchange in metals and the interaction time is in the order of femto to picoseconds. In this paper, the electron-phonon coupling factor of a copper nanofilm with thickness 60 nm deposited on the silicon substrate is measured using the transient thermoreflectance technique. The measured coupling factor is (11~12)×1016 W/(m3K) and very closed to the theoretical value 14×1016 W/(m3K).

本文言語英語
ページ(範囲)499-502
ページ数4
ジャーナルKung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
31
3
出版ステータス出版済み - 3 1 2010

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 機械工学

フィンガープリント

「Experimental study of electron-phonon coupling factor of copper thin film」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル