Fabrication and evaluation of molding and bonding tools for Au micromirror formation

Ryutaro Nishimura, Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    研究成果: Chapter in Book/Report/Conference proceedingConference contribution

    抄録

    In order to fabricate Au micromirrors using a method of simultaneous molding and low-temperature Au-Au bonding, a fabrication method of molding and bonding tools using diamond blade dicing is investigated. Diamond blade dicing of synthetic quartz glass substrates produced smooth sidewall surfaces with root-mean-square roughness of 8 nm in the sample translation direction and that of 56 nm in the perpendicular to the translation direction. Using these fabricated tools, Au micromirrors were successfully formed at 150 °C.

    本文言語英語
    ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ84
    ページ数1
    ISBN(電子版)9784904743034
    DOI
    出版ステータス出版済み - 6 13 2017
    イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, 日本
    継続期間: 5 16 20175 18 2017

    出版物シリーズ

    名前Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

    その他

    その他5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    Country日本
    CityTokyo
    Period5/16/175/18/17

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films

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