Fabrication of a flexible bismuth telluride power generation module using microporous polyimide films as substrates

Kunihisa Kato, Yoshika Hatasako, Makoto Kashiwagi, Harutoshi Hagino, Chihaya Adachi, Koji Miyazaki

研究成果: ジャーナルへの寄稿学術誌査読

31 被引用数 (Scopus)

抄録

In this study, we investigated the effect of the structure of microporous p-type (Bi0.4Te3Sb1.6) and n-type (Bi 2.0Te2.7Se0.3) BiTe-based thin films on their thermoelectric performance. High-aspect-ratio porous thin films with pore depth greater than 1 μm and pore diameter ranging from 300 nm to 500 nm were prepared by oxygen plasma etching of polyimide (PI) layers capped with a heat-resistant block copolymer, which acted as the template. The cross-plane thermal conductivities of the porous p- and n-type thin films were 0.4 W m -1 K-1 and 0.42 W m-1 K-1, respectively, and the dimensionless figures of merit, ZT, of the p- and n-type BiTe films were estimated as 1.0 and 1.0, respectively, at room temperature. A prototype thermoelectric module consisting of 20 pairs of p- and n-type strips over an area of 3 cm × 5 cm was fabricated on the porous PI substrate. This module produced an output power of 0.1 mW and an output voltage of 0.6 V for a temperature difference of 130°C. The output power of the submicrostructured module was 1.5 times greater than that of a module based on smooth BiTe-based thin films. Thus, the thermoelectric performance of the thin films was improved owing to their submicroscale structure.

本文言語英語
ページ(範囲)1733-1739
ページ数7
ジャーナルJournal of Electronic Materials
43
6
DOI
出版ステータス出版済み - 6月 2014

!!!All Science Journal Classification (ASJC) codes

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

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