@inproceedings{63896d57d90b4ddd80ef5caf9d09d060,
title = "Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology",
abstract = "Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.",
author = "Takanori Shuto and Keiichiro Iwanabe and Mutsuo Ogura and Katsuhiko Nishida and Tanemasa Asano",
year = "2014",
month = jan,
day = "30",
doi = "10.1109/EPTC.2014.7028408",
language = "English",
series = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "536--539",
booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
address = "United States",
note = "2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 ; Conference date: 03-12-2014 Through 05-12-2014",
}