Fatigue characteristics of solder joints in BGA-IC package due to vibration (1st report, comparison of package of Pb-free solder ball with that of Pb solder ball under a transverse vibration)

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

研究成果: Contribution to journalArticle査読

抄録

In this paper, a new method was proposed for evaluating the high-cycle fatigue strength of BGA (Ball Grid Array) packages with Pb-free solder and Pb solder due to a vibration. Attaching a weight induced mixed mode stress in the solder ball of a package. To consider the effect of a mixed mode stress occurred in a solder ball and a frequency to fatigue strength of solder ball, a test was carried out with the four kinds of weights which induced the different ratio of nominal normal stress and nominal shear stress in a solder ball (σnn=2, 4, 5, and 6) at various frequencies (10-27 Hz). Based on the nominal shear stress in solder balls, a new evaluation equation to consider the effect of a mixed mode stress in a solder ball was proposed and the scatters of the fatigue strength in Pb-free packages and Pb packages were evaluated with a Weibull distribution. From a successive observation of a cross section during a fatigue test, a position of crack initiation and a propagation path were found out. Although an intermetallic compounds in both of packages were confirmed by an EDX microprobe analysis, they don't contribute to the initiation of a crack in a solder ball.

本文言語英語
ページ(範囲)1725-1732
ページ数8
ジャーナルNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
70
12
DOI
出版ステータス出版済み - 12 2004

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 材料力学
  • 機械工学

フィンガープリント

「Fatigue characteristics of solder joints in BGA-IC package due to vibration (1st report, comparison of package of Pb-free solder ball with that of Pb solder ball under a transverse vibration)」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル