Gene transfer by circulating plasma bubble flow

Yoko Yamanishi, Ryotaro Tanaka, Yuta Arakawa, Yoshimichi Nakatsu

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抜粋

We have succeeded in injection of plasmid to adherent cells which are suspended in the plasma-bubbles laden circulation flow in a chamber. High-speed plasma-bubbles are generated by glass electrode and the air-liquid interface has a stiction force which draws the gene (plasmid) and stick to the air-liquid interface. The circulating flow increased the chance for cells to contact air-liquid interface of bubbles which enclosed plasma or reactive gas. Finally, the high reactive interface enables gene transfer to cells efficiently. This technology of two-dimensional microfluidic chip contributes an option to the high-throughput gene transfer.

元の言語英語
ホスト出版物のタイトル2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ444-447
ページ数4
ISBN(電子版)9781509050789
DOI
出版物ステータス出版済み - 2 23 2017
イベント30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, 米国
継続期間: 1 22 20171 26 2017

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷物)1084-6999

その他

その他30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
米国
Las Vegas
期間1/22/171/26/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • これを引用

    Yamanishi, Y., Tanaka, R., Arakawa, Y., & Nakatsu, Y. (2017). Gene transfer by circulating plasma bubble flow. : 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 444-447). [7863438] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863438