Grain refinement for improved lead-Free solder joint reliability

K. Sweatman, S. D. Mcdonald, M. Whitewick, T. Nishimura, Kazuhiro Nogita

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

4 被引用数 (Scopus)

抄録

The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains, sometimes only a single grain. This combined with the high degree of anisotropy in the mechanical properties of the body-centred tetragonal beta-tin crystal is a significant factor in determining the response of the joint to the strain to which it is subject in service, with consequent implications for reliability. The superior reliability in joints with multiple small grains of random orientation suggests that it would be advantageous if the solder alloy could be made to solidify with that fine grain structure. In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed. The elemental additions were chosen on the basis of previous research as well as an analysis of relevant binary phase diagrams. Solidification theory suggests that an objective of the addition should be to promote the rapid development of a constitutionally undercooled zone ahead of the advancing solid/liquid interface since this is known to favour the repeated nucleation required to achieve a fine grain structure. The results contribute to the growing body of knowledge on the development of microstructure in lead-free solder alloys.

本文言語英語
ホスト出版物のタイトルIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
ページ561-589
ページ数29
出版ステータス出版済み - 9 12 2013
イベントIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013 - San Diego, CA, 米国
継続期間: 2 19 20132 21 2013

出版物シリーズ

名前IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
1

その他

その他IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
国/地域米国
CitySan Diego, CA
Period2/19/132/21/13

All Science Journal Classification (ASJC) codes

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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