Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

研究成果: 著書/レポートタイプへの貢献会議での発言

抜粋

This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

元の言語英語
ホスト出版物のタイトルISOT 2009 - International Symposium on Optomechatronic Technologies
ページ209-214
ページ数6
DOI
出版物ステータス出版済み - 12 31 2009
イベントISOT 2009 - International Symposium on Optomechatronic Technologies - Istanbul, トルコ
継続期間: 9 21 20099 23 2009

出版物シリーズ

名前ISOT 2009 - International Symposium on Optomechatronic Technologies

その他

その他ISOT 2009 - International Symposium on Optomechatronic Technologies
トルコ
Istanbul
期間9/21/099/23/09

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Higurashi, E., Suga, T., & Sawada, R. (2009). Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. : ISOT 2009 - International Symposium on Optomechatronic Technologies (pp. 209-214). [5326083] (ISOT 2009 - International Symposium on Optomechatronic Technologies). https://doi.org/10.1109/ISOT.2009.5326083